... package pin limitation 组件引线限制 package process 封装工艺 package shell 组装外壳 ...
基于78个网页-相关网页
新型封装工艺介绍 - 文本浏览模式 - 文档 - 枢研网 关键词：封装工艺；圆片级封装；SiP封装；RCP封装 [gap=714]Key words: packaging technology；wafer package；SiP package；RCP package
基于26个网页-相关网页
... spherical-loading-unloading extractors 球形进卸料结构连续萃取器 encapsulation technology 封装工艺 completed offense 既遂 ...
基于18个网页-相关网页
封装工艺工程师 Die bonding and wire bonding ; DA PE ; Seam Sealing Process Engr ; WB PE
厚膜封装工艺 thick film package technology
晶圆级的封装工艺 Wafer Level Package ; WLP
太阳能电池封装工艺 Solar Cell Packaging Technology
荧光胶封装工艺 fluorescent glue packaging technology
④晶圆级的封装工艺 Wafer Level Package
封装工艺工程师实习生 Assembly Process Engineer Intern
封装材料及工艺 Packaging materials and processing
封装键合工艺 encapsulation and bonding
Based on the Anisotropic Conductive adhesive Interconnect and Packaging Technology, a set of temperature control system for RFID (radio frequency identification) tag packaging is designed, as well as the PID algorithm experiment.
本文基于各向异性导电胶互连封装工艺,设计了一套用于RFID(射频识别)电子标签封装的固化模块的温度控制系统,并对温控系统进行了PID算法的闭环控制实验。
参考来源 - RFID封装中热压模块温度控制系统的设计与实现·2,447,543篇论文数据，部分数据来源于NoteExpress
初步的封装试验和测试证明了硅基平台无源对准封装工艺的可行性和可靠性。
The feasibility and reliability of the passive aligning silicon optical bench are proved by the packaging experiments and test.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
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