...脂，再透过微压机(microembosser)在树脂上铸出微杯(Microcup®)之立体结构，此时，微杯即被填入所需原料并以封装层(sealing layer)封密。
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该三层结构包括模型层、网格服务封装层和网格服务应用层。
The architecture was made up of model layer, grid service encapsulation layer, and grid service application layer.
UECU软件静态结构由硬件封装层、中间层和应用层组成。
Static structure of UECU software consists of hardware encapsulation layer, modicum layer, and application layer.
所述的第二部分的 磁材为半环形状，所述的封装层将磁材封装成一个整体；
The packaging layer packages the half-ring shaped magnetic material of the second part into an integral body.
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