论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
XML数据封装也提高了访问的机密性和可靠性，无论通过Web还是桌面应用程序访问。
XML data encapsulation also provides improved privacy and reliability when accessing data, either through the Web or desktop applications.
电子封装，硬下提供重型机械振动和意外的影响，出色的可靠性。
The hardened encapsulated electronics offer outstanding reliability under heavy machine vibration and accidental impacts.
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