在该系统中，RBM被设计为一个接口类，全面封装了所用到的RTI服务，并为仿真应用程序提供了方便的访问接口。
The RBM is designed as an interface class that encapsulates all the RTI services used and offers some methods for facilitating access of the simulation application program.
然后通过三维电磁场仿真，并结合微波电路理论对封装结构，特别是高频信号传输路径进行了优化设计，另外对盖板的效应进行了定性分析。
Then, package structure, especially the signal transmitting path structure is optimized using 3d electromagnetic simulation and microwave circuit theory. Effect of package lid is also studied.
全过程动态仿真技术以CPM网络模型作为框架，调用封装好的CYCLONE模型，形成一个分层次的模型结构。
The dynamic simulation model, which is hierarchical, takes CPM network as frames and calls complex CYCLONE simulation model enclosed in advance when needed.
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