适用范围:太阳能硅片,半导体,电子零件等。
Scope: Solar wafers, semiconductor, electronics and other industries.
太阳能硅片的制造工艺主要包括硅片的切割以及绒面制备两部分。
Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.
YMS - 50激光切割机是专用于太阳能硅片电池切割的设备。
YMS-50 Laser cutting machine special used in cutting for solar cell and semiconductor silicon wafer.
应用推荐