刚性多层印制板 rigid multilayer printed board ; rigid-flex multilayer printed board
挠性多层印制板 flexible multilayer printed board
扰性多层印制板 flexible multilayer printed board
积层多层印制板 up multilayer printed board ; build-up multilayer printed board
刚挠多层印制板 flex-rigid multilayer printed board
微波多层印制板 Microwave multilayer printed circuit board
多层印制电路板 [电子] multilayer pc board ; multilayer printed circuit board ; Multilayer printed wiring boards
多层精密印制板 multilayer precision printed board
多层印制线路板 [电子] multilayer printed wiring board
多层刚性印制电路板 Rigid Printed Circuit Board
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简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
对多层印制板工程资料的制作要求做出简要总结，并对提高工程资料的制作质量提出一些建议。
Make out a simple sum about the making requirement of the project datum of the multilayer PCB, and bring forward some advice about improving the quality of making the project datum.
多层印制板的制作是一个生产工序复杂且周期很长的过程，那么造成金属化孔镀层空洞的原因也就很复杂。
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
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