本发明提供一种集成电路结构及其形成方法，该方法即堆叠式晶片的制造方法。

The present invention provides an integrated circuit structure and a method of forming the same, and the method is for fabricating stacked wafers.

youdao

阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

youdao

作为Sencha Touch的一部分，开发者可以使用该库构建针对Apple iOS、Android以及BlackBerry设备的交互式雷达、柱状、直线、堆叠以及饼状图。

Part of the Sencha Touch offering, this library enables developers to build interactive radar, bar, line, stacked, and pie charts that are optimized for Apple iOS, Android and BlackBerry devices.

youdao