...当作填充材料的塞孔技术与蚀刻制作之铜柱技术,其所具备之主要优势为：(1)满足最高密度化与最短导通孔路径之堆叠孔（via on via）设计,并同步提升表面零件焊接密度及层间连结密度、(2)增加零组件之散热性及盲孔导电能力,并可使电讯信号（应答时间）延迟趋于最小...
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堆叠高度，每钻咀的最大钻次，进刀速度是否对板材类型，板厚，曾数，与孔尺寸进行管控？
Is the stack height, maximum hit per drill bit, and feeds and speeds as a function of laminate type, board thickness, layer count and hole size controlled properly?
堆叠的LVL层需要与定制的木螺栓结合，但钻螺栓孔后木材被扭曲，需要花费较长时间，并且缺乏精确度，”Ban说。
The stacked LVL layers needed to be connected with custom wooden bolts, but to drill the bolt holes after the wood was warped would "take time and lack in accuracy, " Ban says.
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