陶瓷基覆铜板(ceramics base copper-clad laminate)是由陶瓷基材、键合粘 接层及导电层(铜箔)等而构成的。陶瓷种类有很多，可按此加以分类，如有A12 03、SiO2、MgO、A1203-SiC、AlN...
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铝基覆铜板 T-Clad
金属基覆铜板 MBCCL
纸基覆铜板 XPC
陶瓷基覆铜箔板 ceramics base copper-clad laminates ; clad laminates
金属基覆铜层压板 metal base copper-clad laminate
铜基覆铜箔板 copper base copper clad laminate
金属基覆铜箔板 metal base copper clad laminate
基材又称覆铜板 Copper Clad Laminates
环氧玻璃布基覆铜箔板 epoxide woven glass fabric copper-clad laminates
论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。
The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.
本文介绍了一种适用于“无铅”焊接的复合基cem - 3覆铜板的研发。
The article introduces a kind of composite material CEM-3 of CCL for lead-free soldering.
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