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介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
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