它具有沉积速度快和表面清洁的特点，特别具有膜层附着力强、绕射性好、可镀材料广泛等优点。
It has a fast deposition rate and surface cleaning features, in particular strong adhesion with the film, diffraction, and can be coated material widely and so on.
本文总结了影响化学镀镍金可焊性的复杂因素如：前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder.
研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；
A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.
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