...结;压制压力;热导率 [gap=1248]Key words: Si-Al electronic packaging materials; liquid phase sintering; pressing pressure; thermal conductivity...
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研究了压制压力、烧结工艺对材料微观组织及性能的影响。
The effects of pressure and sintering process on the microstructure and properties of the materials were investigated.
研究了粉末粒度、压制压力及烧结温度等对多孔钨孔隙度的影响。
Some factors effecting the porosity of porous tungsten, such as powder size, press pressure, sintering temperature, and so on, are discussed in detail.
侧压力的降低大致具有线性关系的特性，且直线倾斜角随压制压力的增加而增大。
The decrease of emphatic pressure is roughly characteristic by linearity, and Angle of slope add by increase of pressure.
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