印刷电路板组装清洗后，常常留有许多白色残渣，这些残渣由许多的化学物反应而成。
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions.
本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
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