就单芯片封装(Single Chip Package)的材质而言, 使用塑料封装( P l a s t i c Package)的方式,是一般市面上常见到的高频组件封装类型,低于3GHz工作频率的射频集...
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...封装(Die Level)、器件级封装(Device Level)、硅圆片级封装(Wafer Lever Packaging)、单芯片封装(Single Chip Packaging)和系统级封装(System on Packaging)。
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由于单芯片系统级封装 System-on-Chip
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
阐述了MEMS的主要封装工艺和技术,包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
SCSP的焊点热疲劳寿命模拟值为1 052个循环周,低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
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