介绍了在单层陶瓷圆片的基础上实现单层陶瓷圆片带引线元件的片式化。
It was introduced how to change single layer ceramic disc components with leads into chip components on the basis of single layer ceramic discs.
陶瓷热敏元件可视不同的使用环境选择单层或复合包封。
Monolayer or combined packaging of ceramic thermosensitive components is selected in dependence on their application environment.
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