套件包括保险丝座和一个适当大小的半导体保险丝。
Kit includes fuse holder and a properly sized semiconductor fuse.
丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.
在本申请中描述的熔丝阵列(40)由于其为交叉点体系结构因此非常紧凑，并且使用很少的半导体面积。
The fuse array (40) described herein is very compact and USES little semiconductor area because of its crosspoint architecture.
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