介绍了采用不同材料类型的粘结膜、半固化片、所需设备和粘结材料，用于生产低到高层数的PTFE多层板的情况。

This article describes the different types of applications, bonding films, equipment needs, and bonding methods used to produce low-count and high-count PTFE multiplayer boards.

youdao

综述了采用低成本的常规FR - 4层压板芯材和低介电常数高性能的半固化片形成的混合结构印制板，它具有较低的信号串扰和较低的成本。

This paper describes the hybrid-construction PCB were fabricated by the FR-4 laminate and high performance low-loss prepreg to achieve lower signal crosstalk and permit lower cost.

youdao