At present, the packaging industry has done plenty of works to the reliability in thermal load while the study of power load is very less.
目前,封装行业对器件热载荷可靠性做了大量研究工作,而对功率载荷的研究很有限。
参考来源 - 功率载荷下叠层芯片尺寸封装热应力分析·2,447,543篇论文数据，部分数据来源于NoteExpress
目前，封装行业对器件热载荷可靠性做了大量研究工作，而对功率载荷的研究很有限。
At present, the packaging industry has done plenty of works to the reliability in thermal load while the study of power load is very less.
应用有限元分析软件ANSYS，模拟功率载荷下叠层芯片封装中各层的温度和应力分布。
The finite element analysis (FET) software ANSYS have been used to simulate the temperature and stress distribution in stacked die package under power load.
升级的最新型无人机提供外部副吊挂负载能力，扩展范围和耐力，增加有效载荷的功率输出。
The latest upgrades provide external under-slung load capability, extended range/endurance and increased electrical payload power output.
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