加工面料范围广、切口平滑无飞边、自动收口、无变形、图形可通过电脑随意设计；
Processing wide range of fabrics, cut smooth without burr, automatic closing, no deformation, graphics by computer random design;
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
磨料水射流加工在切口形成过程中出现冲蚀延时现象，从而在直线切割时形成切口斜度，在圆形零件切割时形成切口锥度。
Phenomenon of erosion delay in forming kerfs by abrasive waterjet will cause kerf incline in straight cutting or kerf taper in circular cutting process.
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