对该些凸块进行蚀刻，以平坦化该些凸块的表面；移除该图案化光阻层；
Then fulfill the etching for these bumps to flatten the surface of these bumps.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
介电层 仅包覆于导电凸块的周围表面或更包覆于基材的部分表面上。
The dielectric layer only covers the peripheral surface of the conductive bump or the partial surface of the substrate.
应用推荐