由实验结果可知钎料凸台可以提供足够的剪切强度。
It is shown that the bumps can supply sufficient shear strength for use.
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。
The manufacture of solder bump is one of the key technologies for area array packaging (AAP).
大模数高凸台圆柱直齿轮是汽车工业上有特殊意义的零件。
The spur gears with big modulus and high boss are critical parts in the automobile industry.
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