减薄，是指对曝光过度或显影过度而无法放大的过于偏黑的负片的一种补救方法。
...艺；手机电池盖；减薄 [gap=977]composite material; In Mold Labelling (IML) process; mobile phone battery cover; thinning ...
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峰值间的距离随厚度的减薄而增大。
The distance between peaks increases as the thickness is reduced.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
The embedded active chip also can be realized by backside thinning and flip chip bonding.
采用减薄硅片衬底厚度和光陷阱技术可望使转换效率达到29%。
It is possible to get 29% efficiency by reducing wafer thickness and employing light trapping technology.
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