功放组件液冷方式主要通过组件冷板上布置的冷却液通道来实现。
The power amplifier module can realize fluid cooling through applying cooling-channel distributed in the refrigeration board.
通过分析，对微通道热沉材料、冷却液、微通道热沉的结构参数以及热沉与激光器列阵条的封装等进行了优化设计。
Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency.
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