介绍了一种全新的体硅微机械工艺，可以取代SOI硅片而直接在普通硅片上对不同的侧壁电学导通部分进行绝缘。
Introduced a new bulk silicon micromaching technology to replace SOI wafer with normal silicon wafer in the application of sidewall electrical connection.
本论文在比较各种类型光开关的特点的基础上，结合现有的工艺条件，完成了一种使用常规体硅微机械加工工艺实现的光开关的设计和制作。
Based on comparing all kinds of MEMS optical-switches and based on the current ability of techniques, this dissertation accomplishes the design and fabrication of the switch.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
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