A new self-assembly method was brought up that took place at liquid-liquid interface with solder as the bonding material.
论文提出并实现了一种在两相界面进行的、以低温焊料作为粘合剂的新型自组装方法。
参考来源 - 液—液界面微元件自组装研究·2,447,543篇论文数据，部分数据来源于NoteExpress
概述了安装技术的现状、课题和将来的密度提高和低温焊料连接。
This paper describes the current status and theme of mounting technology and density rise and low temperature solder connection in the future.
焊接端口阀门适用于不需要拆卸的软焊接管线，采用低温焊料(204oc)。
Solder end valves are designed to be soft soldered into lines without disassembly, using a low temperature solder (400of) (204oc).
文章以日本为例，介绍低温无铅焊料的技术课题与开发方向。
This article take Japan as an example, introduce technical topic and development direction of low temperature lead-free solder.
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