文章介绍了一种采用低温铝钎焊料和钎焊技术的铝合金外壳基板钎焊和密封方法。
Techniques for soldering and encapsulating aluminum-alloy case and substrate based on low-temperature aluminum soldering materials are described in the paper.
利用高新技术，精心设计，高温与外壳表面不发生直接传热，外壳表面处于低温状态。
High tech. design, no direct hot transmit between high temperature zone and out shell. The temperature of the out-surface is low.
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