注意：为满足未来的概要文件要求，第四个系统-零件供应商系统可以容易地扩展样本应用程序的体系结构。
Note: a fourth system, the Part Supplier system, can easily extend the architecture of the sample application to address future profile requirements.
IBM已经为未来几年制定了一个路线图，包括对Hadoop的支持、不同温度带数据(multi - temperature data)、以及网格到非数据库源的扩展。
IBM has laid out a road map for the next several years that includes support for Hadoop, multi-temperature data, and the extension of grid to non-database sources.
该文件的格式是很灵活并易于为 EJBMaker 未来版本扩展的 XML。
The format of the file is XML, which is flexible and easy to extend for future versions of the EJBMaker.
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