向焊料槽中添加纯锡可以对合金进行控制。
在电子电器领域,产品制造过程零配件之间连接导通工艺中的铅锡焊料所引起的环境污染越来越引起人们的重视。
In the electrical and electronic fields, Pb-Sn solder which is used to connect parts in the product manufacturing process can cause environmental pollution, which has drawn increasing attention.
作为目前广泛使用的耗时长的固体贴装预制件的代替品,一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
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