不含树脂的冷杉木料。
根据本发明，不含树脂的焊膏由一种金属粉末，特别是软焊料 和一种凝胶体制成，其中，根据本发明的凝胶体在重熔金属粉末的过 程中，不在金属表面上留下残留物。
The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down.
非金属材料是指如木头，塑料，橡胶，环氧树脂，陶瓷及金刚石等那些不含有金属基材的材料。
Nonmetallic materials are those materials such as woods, plastics, rubbers, epoxy resins, ceramics and diamonds that do not have a metallic base.
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