讨论了实验分光系统、成像系统和高灵敏度探测器列阵混合集成在一块三维硅基片上的初步方案。
An initiative scheme is given to integrate the spectrometer, imaging system and high sensitivity photodiode array in a three dimension silicon chip.
本文还用三维有限差分光束传输法计算了侧边抛磨光纤波导的光学特性。
The three-dimensional finite-difference beam propagation method was used to compute the optical properties of fiber devices based on side-polished fiber.
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