wet plating process 湿式镀工艺
This paper describes new development of wet plating process in micro fine circuit formation. It can form micro fine circuit pattern on improved performance polyimide film.
概述了在微细线路形成中湿式镀工艺的新开发，可以在改性聚酰亚胺膜上形成微细线路图形。
The plating theory, knitting process and thermal-wet comfort of single plated fabric are discussed in this paper through theoretical analysis and experiments.
本文通过理论分析和实验研究对单面纬编添纱织物的添纱理论、编织工艺及织物的热湿舒适性能进行了研究。
The plating theory, knitting process and thermal-wet comfort of single plated fabric are discussed in this paper through theoretical analysis and experiments.
在添纱编织工艺理论基础上，设计并应用一种新型的三向可调导纱器，从而使单面纬编添纱织物的外观得到较大改观。
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