... wafer to wafer repeatability 薄片间重现性 wafer topography 薄片构形 wafer transfer 晶片传送 ...
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wafer r topography 薄片构形
Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.
化学机械抛光(CMP)在半导体工业内获得了广泛的赞同，对控制形貌起伏的硅片表面当作首选方法。
In this paper, the principle of electron beam write wafer is discussed briefly distinguish topography mark, and make the technology of wafer mark which is found by the electron beam exposure system.
本文扼要介绍了电子束直写圆片的原理，地形标记的识别，以及电子束曝光系统能识别的圆片标记的制造技术。
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