wafer handling module 晶片传送组件
wafer-handling robot 硅片传输机器人
Wafer-handling 硅片传输
wafer handling cell 硅片传输单元
Wafer Handling Tools 晶圆周转工具
wafer r handling 晶片传送
wafer r handling module 晶片传送组件
A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.
穿孔金属晶片载体也用于晶片键合,用以容易地处理以及松解。
In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
在过去的两年中,伊智主要为200 mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
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