... 晶圆匣 wafer cassette 晶圆验收测试 wafer acceptance 晶圆平面 wafer-plane ...
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wafer acceptance test 测试 ; 收测试 ; 晶圆参数测试
wafer acceptance testing 晶圆允收测试
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Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.
化学机械抛光(CMP)在半导体工业内获得了广泛的赞同，对控制形貌起伏的硅片表面当作首选方法。
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