由于纳米孔不需要借助电子吸附(electrical contact)、表面修饰(urface modification)或转位过程(translocation process)等步骤就可以装载到芯片上,因此可以得到极高密度的纳米孔芯片。现在的纳米加工技术(nanofabrication)已经可以达到上述要求了。
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Though the arrangement process is very complicated, there are three basic operations: translocation, reversal and transposition .
虽然其生物过程非常复杂,但可归结为三种基本操作:移位、反转和转位。
The scientists named their process "reverse DNA translocation" because, as Ling explained, "the DNA is essentially caught in a tug-of-war."
科学家们将过程命名为“反向基因易位”,因为玲解释说:“DNA的基本上是陷入了拔河比赛。”
These, say the researchers, correspond to drops in conductance when DNA strands slide across the gap via a biochemical process known as translocation.
研究人员认为这是由于DNA链通过时产生了一种叫做易位的生化过程,使得石墨舟的电导发生了下降。
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