The rapid development of the high-density solder interconnection in the electronic packaging industry brings about the continiuous decrease in the size and stand-off height (SOH) of solder joints.
电子封装微互连正向高密度化方向快速发展,微焊点的尺寸及互连高度在不断降低。
参考来源 - 微小互连高度下焊点界面反应及力学性能研究·2,447,543篇论文数据,部分数据来源于NoteExpress
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