A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed.

采用瞬间液相烧结工艺来形成焊接材料，其中首先形成前体材料。

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Factors that affect the surface resistance of the board include the board material, the presence of coatings such as solder masking or conformal coatings, and board cleanliness.

影响印制板表面电阻的因素包括印制板材料、有无涂层(例如防焊漆或保形涂层)，以及电路板的清洁。

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Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.

阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。

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