...龙源期刊网 关键词：倒装焊；模板；焊点形态；可靠性；热疲劳寿命 [gap=954]Keywords: Flip-chip；stencil；solder joint shape；reliability；thermal fatigue life ...
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solder joint shape control 焊点形态控制
solder joint shape prediction 焊点形态预测
theory of solder joint shape 焊点形态理论
three-dimensional solder joint shape 焊点三维形态
3-D shape of solder joint 三维焊点形态
The 3-d evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理和焊点形态理论，建立了LCCC器件焊点三维形态预测模型。
And the different section shape of the solder joint is given with the variation of solder volume.
给出了不同的钎料量对应的焊点剖面形态的变化。
The results are of importance to design and optimize of geometry shape of the solder joint.
这一结果对于焊点几何形态的设计及优化具有指导意义。
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