In the test the solder ability plating coating.

在测试电镀镀层的焊锡能力。

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The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.

本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。

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The ability to print and reprint consistently without Solder deposit degradation characterize the systems accuracy and repeatability for our Customers.

印刷和再版，始终没有焊锡存款退化特征的能力为我们的客户系统的精度和可重复性。

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