silver coated copper powder
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银包覆铜粉
- 引用次数：1
参考来源 - 片式多层陶瓷电容器银铜粉电极材料研究
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The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
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The preparation technology and study status of silver-coated copper powder were introduced.
介绍了银包铜粉的制备工艺及研究现状。
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