Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫,在磨去阻挡层的工序中要用到软垫。
It also describes the result of bismuth removal, and points out the technical measurement to reduce effect of bi on copper cathode quality and the necessity and method to set up bi removal step.
评述了提高脱铋效果,降低铋对阴极铜质量影响的技术措施;指出建立脱铋工序的必要性及途径。
The company is using the system to help step up its removal of unlicensed content and says the technology will allow copyright owners to search Youku's database for unlicensed copies.
公司目前正利用该系统帮助加强盗版内容的去除,并表示这项技术使版权所有者可以在优酷网的数据库中进行搜索以便发现盗版拷贝。
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