... Maximum Likelihood --最大可能性 Multi-Layer Ceramic --多层陶瓷 Micro Lead Package --微引线封装 ...
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Multi -Layer Ceramic Capacitor 高压积层陶瓷电容 ; 宸远科技为一专业高压积层陶瓷电容 ; 专业高压积层陶瓷电容 ; 高压贴片陶瓷电容
multi-layer ceramic package 多层陶瓷封装
Chip multi-layer ceramic capacitors 片式多层陶瓷电容器
MLC multi-layer ceramic capacity 贴片式瓷介电容
Multi -Layer Ceramic Ca 专业高压积层陶瓷电容
Multi -Layer Ceramic Capac 宸远科技为一专业高压积层陶瓷电容
Multi -Layer Ceramic Capacito 专业高压积层陶瓷电容
Conventional MMCM package technologies are usually base on techniques like single-layer or multi-layer ceramic substrates, wire-bonding or flip-chip as chip-to-package interconnects, thick or thin film and flexible materials as dielectrics.
传统的MMCM封装技术采用单层或多层陶瓷基板、用引线键合或倒装焊方式引出芯片信号,在某些方面表现出不错的性能。
参考来源 - 硅埋置型微波多芯片组件封装研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The MLCC (Multi-Layer Ceramic Capacitor) is widely used into portable electronic product.
积层陶瓷电容广泛应用于便携电子产品。
We also provide different multi-layer ceramic structures, ceramic chip capacitor and ceramic dielectric resonator.
提供各种异型陶瓷件，以及陶瓷片式电容，陶瓷介质谐振器。
The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing.
本发明是关于一种通过喷墨涂布同时涂布内电极和外电极的多层陶瓷电容器。
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