...合与芯片键合此外,对于大功率LED封装,必须在芯片设计和封装设计过程中,尽可能采用工艺较少的封装情势(Package-less Packaging),同时简化封装结构,尽可能削减热学和光学界面数,以降低封装热阻,提高出光效率。
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When you can look for items that have less packaging.
寻找有更少包装的商品。
Buy things that have less packaging than other similar products.
买那些与同类产品相比包装较少的东西。
The containers are considered a good choice being more power efficient, and require less packaging materials for servers and a lot less cables.
用容器很不错,可以大大提升能量的使用效率,同时又减少了包装材料以及电缆的需求。
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