The structure of the Light path transition module and unit module, and the interconnection board were designed.
对光路转换模块和单元模块以及该互连板的总体结构进行了分析和设计。
Finally, a new test scheme to detect the crosstalk fault, based on the path delay inertia, for interconnection lines in SoC is proposed.
最后，我们提出一个利用路径延迟惯性原理，来测试系统电路连线之串音障碍的新测试方法。
Patch cables , path panels, and other interconnection components are considered passive Layer 1 components because they simply provide some sort of conducting path.
电缆插座、接线板和其他互联部件被看成无源第一层部件，因为它们只简单提供某种通路。
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