...集成电路封装 [gap=1092]Keywords：Biphenyl Epoxy Resin；Synthesis；Structure Characterization；Integrated Circuit Packaging ...
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large-scale integrated circuit packaging 大规模集成电路封装
Integrated circuit chip packaging process 发明名称
Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
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"The trend in wafer fabrication is outsourcing integrated circuit or IC packaging and Hana will benefit from that, " Potter says.
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