A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.

介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。

youdao

For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.

在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。

youdao

Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.

QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。

youdao