Heat curable adhesive composition, article, semiconductor apparatus and method.
可热固化粘合剂组合物，制品，半导体器械和方法。
DOVER series low temperature curing adhesives are one part, low temperature heat curable epoxy.
DOVER系列低温固化胶是单组份、低温热固化改良型环氧树脂胶粘剂。
This paper discusses a nanometer level precision alignment technique as applied to highly efficient micro optics packaging using heat curable adhesives.
本文讨论纳米精确度光学对准技术，以用于采用热固化树脂的微光学包装。
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