The research on element interdiffusion, reaction and microstructure at the interface of solder joints is vital to the study of lead free solder joints reliability.

因此钎焊过程和服役过程中界面的反应、扩散以及界面的微观组织对当前无铝钎料可靠性研究具有重大意义。

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In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.

为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。

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Through appearance testing, X-Ray testing and temperature cycling testing, the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.

通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。

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