Base materials for printed circuits. part 2: specifications. specification no 15: flexible copper - clad polyimide film, of defined flammability.
印刷电路用基材。第2部分：规范。15号规范：规定易燃性的包铜软聚酰亚胺薄膜。
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade.
印制电路用基材。第2部分：规范。第13号规范：通用级软覆铜聚酰亚胺薄膜，通用级。
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