Three potentials pertinent to various etching techniques are labeled in FIG. 10.
与各种蚀刻技术有关的三个电势标出在图10中。
Methods: ODO scanning electron microscopy (ODO SEM) and freeze-etching techniques were adopted for the study.
方法:采用OD O扫描电镜法和冷冻蚀刻法行电镜观察。
This process is repeated multiple times to apply more layers, with careful monitoring and precise etching techniques applied to each layer, to produce the final layered chip design.
这一过程被重复多次以应用更多的层,通过仔细监测和施加到各个层的精确蚀刻技术,以产生最终的层状芯片设计。
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